Thermal Solution
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With miniaturization and technology advances, IT equipment has gone through revolutionary changes. In the older generation of tower servers, the need for heat dissipation was minimal, and not a serious issue. A present-day Blade Chassis can pack 14 to 16 blades in a most compact space of maximum 14U. With this level of compaction, power consumption levels have soared, and so has the heat inside racks. Efficiently removing heat from enclosures has become a critical challenge for datacenters.
President has evolved various innovative solutions to meet these thermal management challenges
Coolrack
APW President has introduced a new solution for thermal management in high heat density server racks …. the CoolRack with an exhaust duct …. the CoolRack-HD.
Based on the current trend in Data Centres (DC) thermal loads are moving upwards…
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CoolRack-HD
President’s Cool Rack-HD is an innovative enclosure that can address heat loads upto 10 KW. This solution is based on simple principle of isolating the incoming cold air from the hot return air being exhausted from the rear of the…
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Coolway
As the majority of servers sold today require air as the cooling medium, it is essential for any datacenter design to ensure that each and every server location be provided with the correct volume, temperature and humidity of air.
Using…
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BAFT
The Brush Access Floor Tile (BAFT) is an innovative idea for data center floors. When these tiles are placed, the incidence of cold air leakage is reduced considerably, thereby conserving thermal energy and enabling savings in your power bills.
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