With miniaturization and technology advances, IT equipment has gone through revolutionary changes. In the older generation of tower servers, the need for heat dissipation was minimal, and not a serious issue. A present-day Blade Chassis can pack 14 to 16 blades in a most compact space of maximum 14U. With this level of compaction, power consumption levels have soared, and so has the heat inside racks. Efficiently removing heat from enclosures has become a critical challenge for datacenters.
President has evolved various innovative solutions to meet these thermal management challenges